Panasonic Printning SPV-DC

With two lanes, the SPV-DC features high precise SMD-printing, PCB-transfer, recognition and stencil-cleaning for high volumes without changeover time.

With twolanes, the SPV-DC features high precise SMD-printing, PCB-transfer, recognition and stencil-cleaning for high volumes without changeover time.
Features

The Stencil Printer SPV-DC enables high efficiency dual lane production in a compact design.

The printer is designed for high speed production without changeovers.

To reduce running costs the SPV-DC is equipped with the award-winning paperless cleaning function.

Solder paste can refill automatically.

Solder mask and the final printing result can be verified with an internal inspection.

With the machine-to-machine-communication option the SPV-DC is using correction data to correct positional printing errors.

The high-speed printer SPV-DC can print on board sizes from 50 x 50mm to 350 x 300mm. With the dual lanes the printer provides a cycle time of 13s, including transfer, positioning, recognition, high-precision printing and respective cleaning. Due to the non-stop changeover, the SPV-DC allows you to prepare the next production while running the printing process.

Model IDSPV-DC
Model No.NM-EJP9A
PCB dimensions (mm) *1L 50 x W 50 to L 350 x W 300
PCB exchange time13.0 s(6.5 s/PCB) *2 Including transfer, positioning, recognition, each-time cleaning. Printing & cleaning conditions:Our recommended conditions (PCB dimensions L 250 x W 165)
Repeatability2 Cpk ± 5.0 μm 6 σ The repeatability of same PCB Equal to ± 5.0 μm ± 3 σ (or ±2.5 μm ±1.5 σ)
Screen frame dimensions (mm) *3L 736 x W 736, L 650 x W 550, L 550 x W 650, L 750 x W 750, L 584 x W 584
Electric source *41-phase AC 200, 220, 230, 240 V ±10V Max. 4.0 kVA
Pneumatic source *50.5 MPa, 560 L / min (A.N.R.)
Dimensions (mm) *6W 1 650 x D 2 446 x H 1 500 (maximum protusion D 2 528)
Mass *72 650 kg
  1. When using paperless cleaning, dimensions are L50 x W50 – L350 x W250
  2. PCB exchange time varies depending on the machine in the pre-process and the post process, the PCB size, the use of a PCB pressing-down unit and so forth.
  3. For mask specifications, please see the specification.
  4. Including blower and vacuum pump”Option”
  5. When using the mask suction function
  6. Except for the signal tower and the touch panel.
  7. With full options

    *Values such as cycle time and accuracy may vary depending on operating conditions.

    *Please refer to the “Specification booklet” for details. 

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