Panasonic’s Adaptive Process Control (APC) system realizes high-quality placement through excellent feed-forward and feed-back communication technology.
Mounting feed-forward function Components can be placed correctly based on the solder printing position.
Placement skip data feed-forward/Block recognition data feed-forward Placement machine recognition time reduction based on feed-forward discrepancy data. Misplacement of components using a modular placement machine can be prevented based on feed-forward solder/land* printing defect block data. *When inspecting lands on which package components are placed using flux epoxy.
Printing position data feedback The solder printing position misalignment is measured by the inspection machine. The positioning correction is transferred by means of feedback to the screen printer. The solder printing area is measured by the inspection equipment. The stencil cleaning direction can be compared with the reference value by means of feedback.
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