Panasonic NPM-W2 / NPM-W2S

The NPM-W2 combines accurate component placement, precise SPI and AOI inspection and reproductive adhesive dispensing in one high-speed solution.
  • Also available as a single-beam platform NPM-W2S.
The NPM-W2 combines accurate component placement, precise SPI ande AOI inspection and reproductive adhesive dispensing in one high speed solution.

Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market.

This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements.

In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used.

The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38,500 components. 120 feeders can be mounted.

Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data.

As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.

This platform is also available as a single-beam solution:

  • NPM-W2S single beam allows various operations ranging, from NPM-series backup to multiple connection configuration.
  1. Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.
  2. Only for main body
  3. 1 880 mm in width if extension conveyors (300 mm) are placed on both sides.
  4. Dimension D including tray feeder : 2 570 mm
    Dimension D including feeder cart : 2 465 mm
  5. Excluding the monitor, signal tower and ceiling fan cover.
  6. ±25 μm placement support option.(Under conditions specified by PSFS)
  7. The 03015/0402 chip requires a specific nozzle/feeder.
  8. Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)
  9. A PCB height measurement time of 0.5s is included.
  10. One head cannot handle solder inspection and component inspection at the same time.
  11. Please refer to the specification booklet for details.
  12. Foreign object is available to chip components.(Excluding 03015 mm chip)
  13. This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

    *Placement tact time,inspection time and accuracy values may differ slightly depending on conditions
    *Please refer to the specification booklet for details.
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